발행물
컨퍼런스
International Conference on Advanced Electromaterials
2011
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Investigation and Improvement of Bending Reliability for ITO film on Flexible Substrate
Intl. Conf. on Materials and Reliability
2011.11
Feasibility Study of SAW Sensor for Tire Deformation Monitoring Using Tensile and 3 Point Bending Tests
2011 IEEE International 3D Systems Integration Conference (3DIC)
Numerical Anaysis of Bonding Process-Induced Deformation for 3D Package
ENGE (International Conference on Electronic Materials and Nanotechnology for Green Environments)
2010.11
Warpage Characteristics of Thin Packages for Mobile Devices
30th International Conference on Physics of Semiconductors
2010.07
The Mechanical Reliability of Transparent ZnO TFT Transfer Printed on the Flexible Substrate