,

Preventing the formation of cracks in 2.5D glass interposers during the annealing process

,

Optimization of hybrid bonding process conditions through numerical analysis

,

Preventing thermo-mechanical crack formation in 2.5D glass interposer

,

Hybrid bonding Technology for HBM Memory

,

Deformation and cracking behavior of Sub um Pitch Hybrid Bonding by Finite Element Modeling