발행물

전체 논문

957

811

Effects of Wafer Cleaning and Annealing on Glass/Silicon Wafer Direct Bonding
Hong‐Seok Min, Young‐Chang Joo, Ohsung Song
Journal of Electronic Packaging, 2004

812

Direct bonding of silicon paris with heterogeneous insulator using different annealing methods
Ohsung Song, Ki-Yung Lee, Chong Seung Yoon, C. K. Kim
Metals and Materials International, 2004

813

Heteropitaxial growth behavior of Mn doped ZnO thin film no Al2O3(0001)by pulsed laser deposition
10055561
Journal of Applied Physics - 직접입력, 2004

814

HBr/O2 유도결합 플라즈마를 이용한 폴리실리콘 건식식각
범성진, Ohsung Song, Hye-young Lee, Kim Jong Jun
전기전자재료학회논문지 - 등재, 2004

815

Identification of Synthetic and HTHP treated Diamonds
Ohsung Song, Dug-Joong Kim
Journal of the Korea Academia-Industrial cooperation Society, 2004

816

Explanation of LER using the concept of gel layer in chemically amplified photoresists
Joon Yeon Cho, Sejin Choi, Yong Jun Choi, Hong Lae Kim, Kee Ho Kim
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE, 2004

817

Low-resistivity and transparent indium-oxide-doped ZnO ohmic contact to p-type GaN
Jae‐Hong Lim, Dae‐Kue Hwang, Hyun‐Sik Kim, Jin-Yong Oh, J. Yang, R. Navamathavan, Seong-Ju Park
Applied Physics Letters, 2004

818

Low Power Multiplier Design using the Pass Transistor Delay Profile
Hyun‐Sik Kim, Dong Sun Kim, Jong Ho Paik, Duck Jin Jung
ITC-CSCC :International Technical Conference on Circuits Systems, Computers and Communications, 2004

819

Low Power ACSU Architecture with Glitch Reduction
Youn Sung Lee, Dong Sun Kim, Ki Won Kwon, Hyun‐Sik Kim, Won Gi Jeon, Jong Ho Paik
ITC-CSCC :International Technical Conference on Circuits Systems, Computers and Communications, 2004

820

Direct Bonding of Silicon Pairs with Heterogeneous Insulator Using Different Annealing Methods
10055561
Metals and Materials International - 직접입력, 2003