Heterogeneous Integration Toward a Monolithic 3-D Chip Enabled by III-V and Ge Materials
Kim, SH[Kim, Sang-Hyeon], Kim, SK[Kim, Seong-Kwang], Shim, JP[Shim, Jae-Phil], Geum, DM[Geum, Dae-Myeong], Ju, GW[Ju, Gunwu], Kim, HS[Kim, Han-Sung], Lim, HJ[Lim, Hee-Jeong], Lim, HR[Lim, Hyeong-Rak], Han, JH[Han, Jae-Hoon], Lee, SB[Lee, Subin], Kim, HS[Kim, Ho-Sung], Bidenko, P[Bidenko, Pavlo], Kang, CM[Kang, Chang-Mo], Lee, DS[Lee, Dong-Seon], Song, JD[Song, Jin-Dong], Choi, WJ[Choi, Won Jun], Kim, HJ[Kim, Hyung-Jun]
IEEE Journal of the Electron Devices Society, 201802