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전체 논문

174

1

Pressure distribution and Wear of Grinding Wheel in Ultra-Thinning Process of LiTaO3 Wafer
Haeseong Hwang, Seungho Han, Hyunseop Lee
International Journal of Precision Engineering and Manufacturing, 2024

2

An Analysis of Edge Chipping in LiTaO3 Wafer Grinding Using a Scratch Test and FEA Simulation
Haeseong Hwang, Seungho Han, Hyunseop Lee
Lubricants, 2023

3

Tribological Study on Photocatalysis-Assisted Chemical Mechanical Polishing of SiC
Hyunseop Lee
Lubricants, 2023

4

Material Removal Characteristics of Abrasive-Free Cu Chemical-Mechanical Polishing (CMP) Using Electrolytic Ionization via Ni Electrodes
Hyunseop Lee
Micromachines, 2023

5

Approaches to Sustainability in Chemical Mechanical Polishing (CMP): A Review
Hyunseop Lee, Hyoungjae Kim, Haedo Jeong
International Journal of Precision Engineering and Manufacturing-Green Technology, 2022

6

Electrolytically Ionized Abrasive-Free CMP (EAF-CMP) for Copper
Seonghyun Park, Hyunseop Lee
Applied Sciences, 2021

7

Contact-Area-Changeable CMP Conditioning for Enhancing Pad Lifetime
Jungyu Son, Hyunseop Lee
Applied Sciences, 2021

8

Hybrid CMP Slurry Supply System Using Ionization and Atomization
Hoseong Jo, Da Sol Lee, Seon Ho Jeong, Hyun Seop Lee, Hae Do Jeong
Applied Sciences, 2021

9

Preliminary Study on Polishing SLA 3D-Printed ABS-Like Resins for Surface Roughness and Glossiness Reduction
Jungyu Son, Hyunseop Lee
Micromachines, 2020

10

Preliminary Study on Fluidized Bed Chemical Mechanical Polishing (FB-CMP) Process for Stainless Steel 304 (SS304)
Taekyoung Kim, Hyunseop Lee
Micromachines, 2020