발행물
컨퍼런스
The 17th International Symposium on Microelectronics and Packaging (ISMP2018)
2018
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Measurement of Equivalent Modulus of Chip Package Using Bending Test
MPC2018 Fall Conference
Improving Joint Reliability of a Lead-free Solder on a Flexible Substrate under Cyclic Bending by Adding Graphene Oxide Powder
Warpage Analysis of Chip Package using Tri-layer Modeling of Glass Fiber-Reinforced Polymers
The 3rd International Workshop on Active Materials and Soft Mechatronics
Friction Controllable Tendon-Driving Actuation by Using Hygroscopic Deformation of Polymer Tube
The 12th International Conference on Electroluminescence and Optoelectronic Devices (ICEL 2018)
Design of Highly Flexible Organic Light Emitting Diodes Having Oxide-Based Transparent Electrodes and Thin Film Encapsulation layers.