발행물
컨퍼런스
14th International Conference on Modern Materials and Technologies
2018
,
Mechanical Reliability of Advanced Thin Films
68th IEEE Electronic Components and Technology Conference (ECTC)
Effects of ACFs Modulus and Adhesion Strength on the Bending Reliability of CIF(Chip-in-Flex) Packages at Humid Environment
한국금형공학회 2018 춘계학술대회
조향 가능한 의료용 마이크로 카테터 제작 공정에 관한 연구
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference
A Study on Mechanical properties of Thinned Single Crystal Silicon Wafer: Effect of Size and Direction
Strategies for Improving Mechanical Reliability of Thin Film Flexible Electronics