발행물
컨퍼런스
31st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022
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Intra-pair Skew Impact Analysis of High-speed Cables for HDMI Interface
31st IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022
A Low EMI Board-to-board Connector Design for 5G mmWave and High-speed Signaling
Deterministic Policy Gradient-based Reinforcement Learning for DDR5 Memory Signaling Architecture Optimization considering Signal Integrity
DesignCon 2022
Thermal Transmission Line: Smoothing Thermal Gradients and Lowering Temperature for Signal Integrity Improvement of HBM and 2.5D ICs
Deep Reinforcement Learning-based Channel-flexible Equalization Scheme: An Application to High Bandwidth Memory