,

A Novel Spire Clip-type Pogo Connector Design with High Electrical and Thermal Reliability

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Signal Integrity Design and Analysis of a Spiral Through-Silicon Via (TSV) Array Channel for High Bandwidth Memory (HBM)

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Modeling and Analysis of System-Level Power Supply Noise Induced Jitter (PSIJ) for 4 Gbps High Bandwidth Memory (HBM) I/O Interface

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Signal Integrity Design and Analysis of a HDMI 2.1 Connector for Improved Electrical Characteristics

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Learning Collarative Policies to Solve NP-hard Routing Problems