발행물
컨퍼런스
30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021
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Signal Integrity Analysis of High Speed Channel considering Thermal Distribution
Crosstalk-included PAM-4 Worst Eye Diagram Estimation Method for High-speed Serial Links
Deep Reinforcement Learning Framework for Optimal Decoupling Capacitor Placement on General PDN with an Arbitrary Probing Port
Deep Reinforcement Learning-based Pin Assignment Optimization of BGA Packages considering Signal Integrity with Graph Representation
Design and Analysis of HDMI 2.1 Connector for Crosstalk Reduction using Tabs and Inverse Tabs