발행물
컨퍼런스
2020 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2020
,
Deep Reinforcement Learning-based Interconnection Design for 3D X-Point Array Structure Considering Signal Integrity
IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2020
Design and Analysis of Thermal Transmission Line based Embedded Cooling Structures for High Bandwidth Memory Module and 2.5D/3D ICs
Deep Neural Network-based Lumped Circuit Modeling using Impedance Curve
Deep Reinforcement Learning-based through Silicon Via (TSV) Array Design Optimization Method considering Crosstalk
IEEE-MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO)
A Novel Through Mold Plate (TMP) for Signal and Thermal Integrity Improvement of High Bandwidth Memory (HBM)