Heterogeneous Integration toward Monolithic 3D Chip enabled by III-V and Ge Materials
S. –H. Kim*, S. –K. Kim, J. –P. Shim, D. –M. Geum, G. Ju, H. –S. Kim, H. –J. Lim, H. –R. Lim, J. –H. Han, S. Lee, H. –S. Kim, P. Bidenko, C. –M. Kang, D. –S. Lee, J. –D. Song, W. J. Choi, H. –J. Kim
IEEE Journal of the Electron Device Society, 2018