발행물
컨퍼런스
EMAP 2013
2013
,
Evaluation of wafer warpage in 3D stacking technology
KMAPS 2013
Feasibility of micro ABL bumps with flip chip process for high power devices and 3D interconnection
KSPE 2013
Challenges of 3D IC manufacturing
KMRS 2013
Properties of annealed tin oxide thin films and their homojunction pn diode application