,

Ru Passivation Layer Enables Cu-Cu Direct Bonding at Low Temperatures with Oxidation Inhibition

2025

,

Modeling and Reduction of Cu Dishing according to Pad Surface Properties in Chemical Mechanical Polishing

2025

,

Cu/Polymer Hybrid Bonding with Plasma-Assisted Chemical Mechanical Polishing

,

Nano Sandpaper using Carbon Nanotubes as Coated Abrasives for Ultraprecision Surface Finishing

2024

,

Cu/Polymer CMP Technology for Heterogeneous Semiconductor Integration