발행물

전체 논문

144

131

The Effect of Pad-asperity Curvature on Material Removal Rate in Chemical-mechanical Polishing
Kim, Sanha, Saka, Nannaji, Chun, Jung-Hoon
Procedia CIRP, 2014

132

Modeling and mitigation of pad scratching in chemical-mechanical polishing
Kim, Sanha, Saka, N., Chun, J. -H., Shin, S. -H.
CIRP ANNALS-MANUFACTURING TECHNOLOGY, 2013

133

Hybrid micromachining using a nanosecond pulsed laser and micro EDM
Kim, Sanha, Kim, Bo Hyun, Chung, Do Kwan, Shin, Hong Shik, Chu, Chong Nam
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 201001

134

Nanoporous Capillary Gripper for Ultragentle Micro­Object Manipulation
Kim, Sanha, Kim, Seong Jae, Kim, Taehoon, Ryu, Hyun Jun, Jeong, Ji­hun, Hart, A. John
Advanced Science, 1970

135

Ultrathin 3D Cu/Li Composite with Enhanced Li Utilization for High Energy Density Li­Metal Battery Anodes
Kim, Sanha, Yang, Inyeong, Baek, Hyunwoong, Kim, Dong Geun
Small, 1970

136

A Mechanics-Based Predictive Model for Scratching Defects and its Application for Pad Selection in Chemical Mechanical Polishing
Kim, Sanha, Je, Hyeongmin, Kim, Dong Geun, Yun, Seounghee, Shin, Somin, Lee, Haesung A., Kim, Hyunsoo
Tribology International, 1970

137

Mitigation of Cu dishing in chemical mechanical polishing using micro-structured pads
Kim, Sanha, Park, Seulah, Kang, Sukkyung, Kim, Dong Geun
CIRP Annals, 1970

138

Geometrical design and SLIPS lubrication for enhancement of negative-pressure-driven internal flow rate in metal pipes 
Dong Geun Kim, Changhwan Jang, Seong Jae Kim, Daegyoum Kim, Sanha Kim
Tribology and Lubricants, 2021

139

Micromachining using hybrid of laser beam and electrical discharge machining
Sanha Kim, Do Kwan Chung, Bo Hyun Kim, Kwang Hwan Oh, Sung Ho Jeong, Chong Nam Chu
Journal of the Korean Society for Precision Engineering, 2009

140

Characteristics of PVD SiCN for Application in Hybrid Cu Bonding
Kim, Sanha, Choi, Junyoung, Jang, Suin, Lee, Dongmyeong, Kang, Sukkyung, Kim, Sarah Eunkyung
JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE, 202502