Influence of Pd Doping on Electrical and Thermal Properties of n-Type Cu0.008Bi2Te2.7Se0.3 Alloys
Se Yun Kim, Hyun‐Sik Kim, Kyu Hyoung Lee, Hyun-joon Cho, Sung-sil Choo, Seok Won Hong, Yeseong Oh, Yerim Yang, Kimoon Lee, Jae-Hong Lim, Soon‐Mok Choi, Hee Jung Park, Weon Ho Shin, Sang‐il Kim
Materials, 2019
226
Enhanced Thermoelectric Performance of Cu-incorporated Bi0.5Sb1.5Te3 by Melt Spinning and Spark Plasma Sintering
Hyun-joon Cho, Hyun‐Sik Kim, Minyoung Kim, Kyu Hyoung Lee, Sung Wng Kim, Sang‐il Kim
Journal of Electronic Materials, 2019
227
Critical role of atomic-scale defect disorders for high-performance nanostructured half-Heusler thermoelectric alloys and their thermal stability
Ho Jae Lee, Kyu Hyoung Lee, Liangwei Fu, Gyeongtak Han, Hyun‐Sik Kim, Sang‐il Kim, Young‐Min Kim, Sung Wng Kim
Acta Materialia, 2019
228
Emission Enhancement of Cu-Doped InP Quantum Dots through Double Shelling Scheme
Hwi-Jae Kim, Jung‐Ho Jo, Suk‐Young Yoon, Dae‐Yeon Jo, Hyun‐Sik Kim, Byoungnam Park, Heesun Yang
Materials, 2019
229
Cu-incorporation by melt-spinning in n-type Bi2Te2.7Se0.3 alloys for low-temperature power generation
Minyoung Kim, Sang‐il Kim, Hyun-joon Cho, Hyuna Mun, Hyun‐Sik Kim, Jae‐Hong Lim, Sung Wng Kim, Kyu Hyoung Lee
Scripta Materialia, 2019
230
Formation of a functional homo-junction interface through ZnO atomic layer passivation: Enhancement of carrier mobility and threshold voltage in a ZnO nanocrystal field effect transistor
Young‐Jun Kim, Mincheol Chang, Seongeun Cho, Minkyong Kim, Hyun‐Sik Kim, Eunsoo Choi, Hyungduk Ko, Jin‐Ha Hwang, Byoungnam Park