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전체 논문

400

231

Electrical and thermal transport properties of S- and Te-doped InSe alloys
Ji-Il Kim, Hyun‐Sik Kim, Sang‐il Kim
Journal of Physics D Applied Physics, 2019

232

Beneficial Influence of Co‐Doping on Thermoelectric Efficiency with Respect to Electronic and Thermal Transport Properties
Hyun‐Sik Kim, Sung‐sil Choo, Hyun‐jun Cho, Sang‐il Kim
physica status solidi (a), 2019

233

Enhanced thermoelectric transport properties of n-type InSe due to the emergence of the flat band by Si doping
Kyu Hyoung Lee, Min-Wook Oh, Hyun‐Sik Kim, Weon Ho Shin, Kimoon Lee, Jae-Hong Lim, Ji-il Kim, Sang‐il Kim
Inorganic Chemistry Frontiers, 2019

234

Tunable Emission of Bluish Zn–Cu–Ga–S Quantum Dots by Mn Doping and Their Electroluminescence
Jong‐Hoon Kim, Kyung-Hye Kim, Suk‐Young Yoon, Yuri Kim, Sun‐Hyoung Lee, Hyun‐Sik Kim, Heesun Yang
ACS Applied Materials & Interfaces, 2019

235

Electronic Skin to Feel “Pain”: Detecting “Prick” and “Hot” Pain Sensations
Minkyung Sim, Kyung Lee, Kwon Sik Shin, Jeong Hee Shin, Ji‐Woong Choi, Hongsoo Choi, Cheil Moon, Hyun‐Sik Kim, Yuljae Cho, Seung Nam, Jae Eun Jung, Jung Inn Sohn, Jae Eun Jang
Soft Robotics, 2019

236

The keys for effective distribution of intergranular voids of peapod-like MnO@C core-shell for lithium ion batteries
In-Hwan Ko, Aihua Jin, Min Kun Kim, Jae-Hyuk Park, Hyun‐Sik Kim, Seung‐Ho Yu, Yung‐Eun Sung
Journal of Alloys and Compounds, 2019

237

Lane Tracking of Autonomous Vehicles using PID Control
Hyun‐Sik Kim, Jae-Young Jang, Chan-Su Kim, Joongnam Jeon
Proceedings of the Korea Information Processing Society Conference, 2019

238

실로퓨트의 세팔로마닌 흡착: 등온흡착식 및 속도론적·열역학적 특성
Hyun‐Sik Kim, Jin‐Hyun Kim
Korean Journal of Chemical Engineering, 2019

239

Design and Manufacture of a Plastic Drone Using Finite Element Analysis and Fused Deposition Modeling Process
Hyun‐Sik Kim, Dong Gyu Ahn, Seung Ki Moon
Transactions of the Korean Society of Mechanical Engineers A, 2019

240

Point Defect Engineering Approaches to Enhance the Performance of Thermoelectric Materials
Hyun‐Sik Kim, Hyung Mo Jeong, Soon‐Mok Choi, Kyu Hyoung Lee
Journal of the Microelectronics and Packaging Society, 2019