SYSTEM PACKAGING AND INTERCONNECTION (SPAI) LABORATORY
세종대학교 본교(제1캠퍼스) 반도체시스템공학과
김영우 교수
Electromagnetic Compatibility
Signal Integrity
Interposer Design
구성원
김영우 교수
세종대학교 본교(제1캠퍼스) 반도체시스템공학과
경력
2023 ~ 현재
Assistant Professor
Department of Semiconductor System Engineering, Sejong University, Korea
2018 ~ 2019
Post-doctoral Researcher
Institute of Information and Electronics, KAIST
2013 ~ 2018
Graduate Research Assistant
School of Electrical Engineering, KAIST
2018 ~ 2019
Technical Consultant
Invecas Inc. (USA & India)
2017 ~ 2019
Standard Activity
HDMI Forum
~ 현재
Borating with Prof. Hayashi & Fujimoto, Leaders of the Lab
2020 ~ 현재
Associate Editor, IEEE Transactions on Components, Packaging, and Manufacturing Technology (TCPMT)
2020 ~ 2020
Technical Program Committee Member, IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO)
2022 ~ 2022
Technical Program Committee Member & Special Session Organizer & Reviewer, 2022 Asia Pacific International Symposium on Electromagnetic Compatibility (APEMC)
2023 ~ 2023
Technical Program Committee Member & Reviewer, 7th IEEE Global EMC Conference (GEMCon) 2023
~ 현재
Journal Reviewer
~ 현재
Member of IEEE (EMC Society, Advanced Packaging Society, Microwave Theory and Techniques Society)
~ 현재
Member of Young Engineer Honor Society, NAEK (National Academy of Engineering of Korea, 한국공학한림원)
학력
2015 ~ 2018
Ph.D.
Korea Advanced Institute of Science and Technology (KAIST)
2013 ~ 2015
M.S.
Korea Advanced Institute of Science and Technology (KAIST)
2009 ~ 2013
B.S.
Korea University