International Conference on Plasticity, Damage, and Fracture

CONSTITUTIVE MODELING FOR MULTI-SCALE SIMULATION OF BUMPLESS HYBRID BONDING PROCESSES IN SEMICONDUCTOR DIE STACKING FOR HIGH-PERFORMANCE COMPUTING SYSTEM

2026

2025 IEEE 75th Electronic Components and Technology Conference (ECTC)

Crystal Plasticity-Based Modeling and Experimental Validation of the Influence of Microstructures and Grain Boundary Junction Types on the Cu-Cu Bonding Interface

2025

IEEE 75th Electronic Components and Technology Conference (ECTC)

An Effective 3D Thermal Network Integrated With Deep Learning for Improved Prediction of the 3D Thermal Properties of Complex Packaging Patterns

2025

2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Multi-physics modeling of dissipation analysis for Lithium-ion batteries

2025

International Conference on Plasticity, Damage, and Fracture 2024

KEY NOTE: UNIFIED MODELING OF ELECTROMAGNETIC-THERMAL-MECAHICAL INELASTIC BEHAVIOR OF MATERIAL: THEORY AND INDUSTRIAL APPLICATION

2024