Effects of diamond size of CMP conditioner on wafer removal rates and defects for solid (non-porous) CMP pad with micro-holes

Effect of oxidation on Li-ion secondary battery with non-stoichiometric silicon oxide (SiOx) nanoparticles generated in cold plasma

Thin film-coated plastic optical fiber probe for aerosol chemical sensing applications

A novel approach to use of elastomer for monitoring of pressure using plastic optical fiber

Effects of Process Variables on TiN Particle Formation during Metallorganic Chemical Vapor Deposition

Damage-Free Design of a Megasonic Waveguide for Single-Wafer Processing

Measurement of CMP Slurry Abrasive Size Distribution by Scanning Mobility Particle Sizer

Study of Polishing Characteristics of Monodisperse Ceria Abrasive in Chemical Mechanical Planarization

Investigation on Surface Hardening of Polyurethane Pads During Chemical Mechanical Polishing (CMP)

Step height removal mechanism of chemical mechanical planarization (CMP) for sub-nano-surface finish