발행물

전체 논문

398

1

Nickel–tin transient liquid phase sintering with high bonding strength for high‑temperature power applications
Jeong-Won Yoon, Young-Se Kim, So-Eun Jeong
Journal of Materials Science: Materials in Electronics, 2019.11

2

Optimal Ni(P) thickness and reliability evaluation of thin-Au/Pd(P)/Ni(P) surface-finish with Sn-3.0Ag-0.5Cu solder joints
Jungsoo Kim, Seung-Boo Jung, Jeong-Won Yoon
Journal of Alloys and Compounds, 2019.10

3

Effects of Ni layer thickness of thin-ENEPIG surface finishes on interfacial reactions and shear strength of Sn-3.0Ag-0.5Cu solder joints during aging
Jungsoo Kim, Jong-Hoon Back, Seung-Boo Jung, Jeong-Won Yoon
Journal of Materials Science: Materials in Electronics, 2019.07

4

Initial interfacial reactions of Ag/In/Ag and Au/In/Au joints during transient liquid phase bonding
Jeong-Won Yoon, Byung-Suk Lee
Microelectronic Engineering, 2018.12

5

Sequential interfacial reactions of SAC305 solder joints with thin ENEPIG surface finishes
Jeong-Won Yoon, Jong-Hoon Back, Seung-Boo Jung
Surface and Interface Analysis, 2018.11

6

Effect of sintering conditions on mechanical strength of Cu-sintered joints for high-power applications
Jeong-Won Yoon, Jong-Hoon Back
Materials, 2018

7

Effect of surface finish metallization on mechanical strength of Ag sintered joint
Jeong-Won Yoon, Jong-Hoon Back, Seung-Boo Jung
Microelectronic Engineering, 2018.10

8

Sequential interfacial reactions of Au/In/Au TLP-bonded joints for power electronics applications
Jeong-Won Yoon, Byung-Suk Lee
Thin Solid Films, 2018.08

9

Improvement in Thermomechanical Reliability of Low Cost Sn-Based BGA Interconnects by Cr Addition
Junghwan Bang, Dong-Yurl Yu, Ming Yang, Yong-Ho Ko, Jeong-Won Yoon, Hiroshi Nishikawa, Chang-Woo Lee
Metals, 2018

10

Comparative study of ENEPIG and thin ENEPIG as surface finishes for SAC305 solder joints
Jeong-Won Yoon, Jong-Hoon Back, Seung-Boo Jung
Journal of Materials Science: Materials in Electronics, 2018.03