,

Interfacial reactions of Sn-Ag/Cu pillar bump joints with Ni insertion layer fabricated by intense pulsed light soldering

2008.11

,

Investigation of Electroless Au and Ag Plating Layers for Low Temperature Cu-Cu Bonding

,

Transient Liquid Phase Bonding Using Sn-Ni-Sn Metal Composite Preform and the Long-term Reliability of the Joint

,

Intense pulsed light soldering properties of Sn-Ag-Cu solder joints and comparison to traditional reflow soldering

,

Effects of TiC nanoparticle addition on properties of Sn58Bi/Sn3.0Ag0.5Cu hybrid solder joints for low-temperature electronic packaging