발행물
컨퍼런스
The 22nd International Symposium on Microelectronics and Packaging (ISMP2024)
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Metallurgical interfacial reaction and mechanical long-term reliability evaluation of Sn-Ag/Ni UBM flip-chip solder bump joints with high-temperature aging
Effect of Cu microstructure on interfacial compounds formation and growth in Sn-3.0Ag-0.5Cu solder joints
26th Electronics Packaging Technology Conference (EPTC 2024)
Effects of Intense Pulsed Light Energy on Metallurgical Properties of Cu Pillar Joints
제31회 한국반도체학술대회 (The 31st Korean Conference on Semiconductors)
Effects of ALD Al2O3 layer on interfacial reaction of Sn-3.0Ag-0.5Cu solder joints
Cu grain size에 따른 SAC305/Cu 접합부 금속간화합물 성장 거동 분석