발행물
컨퍼런스
대한금속재료학회
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Intermetallic Compound Layer Growth By Solid State Reactions Between Sn-58Bi solder and Copper, Nickel Substrates
대한용접학회
A Study on the wettability of Sn-3Ag-5In-8Bi solder
Study on Activation Energies of Intermetallic Compound Growth of Sn-5Bi-3.5Ag/Cu system during Aging in Solid State