발행물
컨퍼런스
대한용접학회
,
Study on Intermetallic Compound Growth of Pb-free Solder with Cu Substrate
Study on Interfacial Reaction of Sn-Cu-Ni Solder with Surface Finish
International Welding/Joining Conference-Korea 2002
Interfacial Reaction Between Sn-58Bi Eutectic Solder and (Cu, electroless Ni-P/Cu) substrate
Study on Interfacial Reactions between Indium Solder and Cu, Ni Substrate
대한금속재료학회
Interfacial Reactions between Eutectic Sn-Ag solder and Cu substrate