발행물
컨퍼런스
IMAPS 2003, 36th International Symposium on Microelectronics
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Effect of Isothermal Aging on the Intermetallic Compound Layer Growth in BGA Joints with Sn-Ag-Cu Solder
대한용접학회 추계학술발표대회
Sn-3Ag-6Bi-2In BGA 솔더 접합부의 반응특성과 접합강도
3th International Symposium on Designing, Processing and Properties of Advanced Engineering Materials
Growth Kinetics of IMC Formed between Sn-3.5Ag-0.75Cu BGA Solder and (Cu, immersion Au/electroless Ni-P/Cu) Substrate
Influence of Shear Speed on the Shear Force of Eutectic Sn-Pb and Pb-Free BGA Solder Joints
대한금속재료학회 추계학술발표대회
Sn-Ag-Bi-In솔더를 이용한 BGA접합부의 금속간화합물 성장과 접합부 신뢰성에 미치는 고상시효의 영향