발행물

전체 논문

321

31

Reliability study of hermetic wafer level MEMS packaging with through-wafer interconnect
Sung-Hoon Choa
Microsystem Technology(SCI), 2009.03

32

Easy calibration method of vision system for in-situ measurement of strain of thin films
Jun-Hyub PARK, Dong-Joong KANG, Myung-Soo SHIN, Sung-Jo LIM, Son-Cheol YU, Kwang-Soo LEE, Jong-Eun HA, Sung-Hoon Choa
Transactions of Nonferrous Metals Society of China (SCIE), 2009

33

Effects of Self-Assembled Monolayer and PFPE Lubricant on Wear Characteristics of Flat Silicon Tips
H. J. Kim, C. E. Jang, D. E. Kim, Y. K. Kim, Sung-Hoon Choa, S. Hong
Tribology Letters (SCI), 2009.02

34

Quality Factor Measurement of Micro Gyroscope Structure according to Vacuum Level and Desired Q-factor Range Package Method
J.S. Kim, S.W. Lee, K.D. Jung, W.B. Kim, SunSung-Hoon Choa, B.K. Ju
Micro- electronics Reliability(SCI), 2008

35

Comparative Instabilities Analysis for a-Si:H Body-Tied TFT (BT-TFT) and Floating Body TFT (FB-TFT) under Bias Temperature Stressing (BTS)
Yong K. Lee, Sung-Hoon Choa
Modern Physics Letters B (SCI), 2008

36

Etch Characteristics of Magnetic Tunnel Junction Stack with Nanometer-Sized Patterns for Magnetic Random Access Memory
S.R. Min, H.N. Cho, K.W. Kim, Y.J. Cho, Sung-Hoon Choa, C. W. Chung
Thin Solids Films(SCI), 2008.03

37

90 Bent Metallic Waveguide with a Tapered C-Shpaed Aperature for Use in HAMR
J.B Lee, E. Cho, S. Suh, P. C. Hansen, J. Sohn, Sung-Hoon Choa, L. Hesselink
Proc. of SPIE, 2007.08

38

Grain Size Reduction of CoCrPt-SiO2 Media by Oxidation of RuCr Intermediate Layer Grain Boundary
S.H. Park, S.O. Kim, H.S. Oh, Sung-Hoon Choa, T.D. Lee
Physica Status Solidi C, 2007.10

39

Magnetic and Recording Performance of Perpendicular Magnetic Media with New Soft Underlayer Structure
S.Y. Yoon, S.H. Kong, H.S. Lee, C.K. Lim, H.J. Kim, H.S. Oh, J.B. Park, Sung-Hoon Choa
Physica Status Solidi C, 2007.10

40

Magneto-Logic Device Based on Single-Layer Magnetic Tunnel Junction
S. Lee, Sung-Hoon Choa, S. Lee, Hyungsoon Shin
IEEE Transaction on Electronic Devices(SCI), 2007.08