발행물

전체 논문

321

51

Mechanical Behavior of Freestanding Mo Thin Films for RF MEMS Devices
Jae-Hyun Kim, H. Lee, K. Cho, S. Han, J. Kim, J. Kim, J. Kang, Sung-Hoon Choa
International Journal of Modern Physics B, 2006.09

52

Symmetric AFM Cantilever for Mechanical Characterization of Mo Thin Film
Hak-Joo Lee, J.Kim, K. Cho, J. Kang, C. Baek, J. Kim, Sung-Hoon Choa
International Journal of Modern Physics B, 2006.09

53

Mechanical Properties of Au Thin Film for Application in MEMS/NEMS using Micro tensile Test
S.W. Han, H.W. Lee, H.J. Lee, J.Y. Kim, J.H. Kim, C.S. Oh, Sung-Hoon Choa
Current Applied Physics (SCIE), 2006.08

54

Experimental Studies of Through-Wafer Copper Interconnect in Wafer Level MEMS Packaging
Sung-Hoon Choa
Key Engineering Materials (SCI), 2006.09

55

Thermo-mechanical Behavior of MEMS Gyroscope Sensor Package Subjected to Temperature Change
Jin-Won Joo, Yong Chul Cho, Jonghwa Won, Sung-Hoon Choa
Key Engineering Materials(SCI), 2006.09

56

Reliability of Hermetic RF MEMS Wafer Level Packaging Using Au-Sn Eutectic Bonding
Qian Wang, Sung-Hoon Choa, WoonBae Kim, Junsik Hwang, Sukjin Ham, Changyoul Moon
Key Engineering Materials, 2006.10

57

Effects of Packaging Induced Stress on MEMS Devices and Its Improvements
Sung-Hoon Choa
1970

58

Stretchable Metal-Grid Transparent Electrode Using Ag Flake and Polyester Nanocomposites
Jin Yeong Park, Won Jae Lee, Yo Seb Lee, Sung-Hoon Choa
Nanoscience and Nanotechnology Letters, 2018

59

Electromechanical Properties of a Highly Flexible and Stretchable Nanocomposite Conductor
Won Jae Lee, Jin Yeong Park, Bo Seok Kwon, Su Yong Nam, Sung-Hoon Choa
Nanoscience and Nanotechnology Letters, 2018

60

Development of Novel Through Mold via in Package-on-Package Using Cu-Cored Solder Ball
Young Moon Jang, Byoung-Ho Ko, Hoon Sun Jung, Jin Wook Jeong, Sung-Hoon Choa
Nanoscience and Nanotechnology Letters, 2018