발행물

전체 논문

321

81

Mechanical Integrity of Flexible In–Zn–Sn–O Film for Flexible Transparent Electrode
Young Sung Kim, Se-In Oh, Sung-Hoon Choa
Japanese Journal of Applied Physics(SCI), 2013

82

Mechanical Flexibility of ZnSnO/Ag/ZnSnO Films Grown by Roll-to-Roll Sputtering for Flexible Organic Photovoltaics
Jong-Wook Lim, Se-In Oh, Kyoungtae Eun, Sung-Hoon Choa, Hyun-Woo Koo, Tae-Woong Kim, Han-Ki Kim
Japanese Journal of Applied Physics(SCI), 2012

83

Mechanical Integrity of Flexible Ag Nanowire Network Electrodes Coated on Colorless PI Substrates for Flexible Organic Solar Cells
Jong-Wook Lim, Da-Young Cho, Kyoungtae Eun, Sung-Hoon Choa, Seok-In Na, Jihoon Kim, Han-Ki  Kim
Solar Energy Materials & Solar Cells(SCI), 2012

84

Development of a High-Sensitivity Strain Measurement System Based on a SH SAW Sensor
Haekwan Oh, Keekeun Lee, Kyoungtae Eun, Sung-Hoon Choa, Sang Sik Yang
Journal of Micromechanics and Microengineering (SCI), 2012

85

Mechanical Integrity of Flexible InZnO/Ag/InZnO Multilayer Electrodes Grown by Continuous Roll-to-Roll Sputtering
Sung-Hoon Choa, Chung-Ki Cho, Woo-Jin Hwang, Kyung Tae Eun, Han-Ki Kim
Solar Energy Materials & Solar Cells(SCI), 2011

86

Improving the Insertion Loss and Sensitivity over Existing SAW Strain Sensor
Haekwan Oh, Keekeun Lee, Kyungtae Eun, Sunghun Choa, Sang Sik Yang
Procedia Engineering, 2011

87

Mechanical Reliability of Transparent Conducting IZTO Film Electrodes for Flexible Panel Displays
Young Sung Kim, Woo Jin Hwang, Kyung Tae Eun, Sung-Hoon Choa
Applied Surface Science (SCI), 2011

88

Mechanical Flexibility of Transparent PEDOT:PSS Electrodes Prepared by Gravure Printing for Flexible Organic Solar Cells
Chung-Ki Cho, Woo-Jin Hwang, Kyoungtae Eun, Sung-Hoon Choa, Seok-In Na, Han-Ki Kim
Journal of Solar Energy Materials and Solar Cells(SCI), 2011

89

Development of Micro-Heaters with Optimized Temperature Compensation Design for Gas Sensors
Woo-Jin Hwang, Kyu-Sik Shin, Ji-Hyoung Roh, Dae-Sung Lee, Sung-Hoon Choa
Sensors(SCIE), 2011

90

Reliability Study of Hermetic Wafer Level MEMS Packaging with Through-Wafer Interconnect
Sung-Hoon Choa
Microsystem Technology(SCI), 2009.03