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전체 논문

160

81

Effect of Pre-cooling Treatment on the Formation of the Low Resistivity Titanium Silicide
Journal of Vacuum Science and Technology B, 2001

82

Properties of electroplated copper thin film and its interfacial reactions in the EPCu/IMPCu/IMPTaN/SiO2/Si multilayer structure
Materials Science and Engineering B, 2001

83

FORMATION MECHANISM AND CRYSTALLOGRAPHIC RELATIONSHIP OF EPITAXY Ti AND Al THIN FILMS IN IONIZED METAL PLASMA DEPOSITION
Surface Review and Letters, 2001

84

STUDY OF Cu DIFFUSION IN Cu/TaN/SiO2/Si MULTILAYER STRUCTURES
Surface Review and Letters, 2001

85

High Density Diffusion Barrier of Ionised Metal Plasma Deposited Ti in Al-0.5%Cu/Ti/SiO2/Si Structure
J. Vacuum Sci. Tech. B, 2001

86

Study of interfacial reactions in ionized metal plasma (IMP) deposited Al-0.5%wtCu/Ti/SiO2/Si structure
Journal of Materials Science, 2000

87

Irreversible hydrogen effects on resistivity of sputtered copper films
Journal of Materials Science, 2000

88

Characterization of interfacial reactions between ionized metal plasma deposited Al.0.5 wt.% Cu and Ti on SiO2
Materials Science and Engineering B, 2000

89

Study of diffusion barrier properties of ionized metal plasma (IMP) deposited TaN between Cu and SiO2
Materials Science in Semiconductor Processing, 2000

90

Study of diffusion barrier properties of ternary alloy (TixAlyNz) in Cu/TixAlyNz/SiO2/Si thin film structure
Materials Science in Semiconductor Processing, 2000