Effect of Pre-cooling Treatment on the Formation of the Low Resistivity Titanium Silicide

Properties of electroplated copper thin film and its interfacial reactions in the EPCu/IMPCu/IMPTaN/SiO2/Si multilayer structure

FORMATION MECHANISM AND CRYSTALLOGRAPHIC RELATIONSHIP OF EPITAXY Ti AND Al THIN FILMS IN IONIZED METAL PLASMA DEPOSITION

STUDY OF Cu DIFFUSION IN Cu/TaN/SiO2/Si MULTILAYER STRUCTURES

High Density Diffusion Barrier of Ionised Metal Plasma Deposited Ti in Al-0.5%Cu/Ti/SiO2/Si Structure

Study of interfacial reactions in ionized metal plasma (IMP) deposited Al-0.5%wtCu/Ti/SiO2/Si structure

Irreversible hydrogen effects on resistivity of sputtered copper films

Characterization of interfacial reactions between ionized metal plasma deposited Al.0.5 wt.% Cu and Ti on SiO2

Study of diffusion barrier properties of ionized metal plasma (IMP) deposited TaN between Cu and SiO2

Study of diffusion barrier properties of ternary alloy (TixAlyNz) in Cu/TixAlyNz/SiO2/Si thin film structure