발행물
컨퍼런스
23rd Conference on Electrical Performance of Electronic Packaging and Systems
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Through Silicon Via (TSV) Noise Coupling Effects on RF LC-VCO in 3D IC
Crosstalk Included Eye Diagram Estimation of High-speed and Wide I/O Interposer Channel for 2.5D / 3D IC
Electromagnetic Compatibility (EMC EUROPE), 2014 IEEE International Symposium
Design of Magnetic Shielding for Reduction of Magnetic Near Field from Wireless Power Transfer System for Electric Vehicle
2014 IEEE International Symposium on Electromagnetic Compatibility(EMC&SIPI)
Bump-less High Speed Channel on Silicon, Organic and Glass Interposer
2014 IEEE International Symposium on Electromagnetic Compatibility(EMC&SI/PI)
Electroststic Discharge(ESD) Effects on Wireless Power Transfer using Magnetic Resonance Coupling