발행물
컨퍼런스
IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo)
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Design of Contactless Wafer-level TSV Connectivity Testing Structure using Capacitive Coupling
Design and Measurement of a Compact On-interposer Passive Equalizer for Chip-to-chip High-speed Differential Signaling
2013 IEEE Electrical Design of Advanced Package & Systems Symposium
Design of Crosstalk Compensation Passive Equalizers for High-speed Differential Signaling on 2.5D-IC Interposer
2013 IEEE Electrical Design of Advanced Packaging and Systems
Wireless Power Distribution Network for 3D Package Using Magnetic Field Resonance
Global Interposer Workshop 2013
Suppression of Power Distribution Network(PDN) Resonances in Glass Interposer