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Measurement and Analysis of Voltage Transfer Ratio (VTR) of Package-level WPT considering PDN Conditions

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Noise Coupling of Through-Via in Silicon and Glass Interposer

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Structure of Handheld Resonant Magnetic Coupling Charger (HH-RMCC) for Electric Vehicle considering Electromagnetic Field

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How to Improve Power Integrity on Analog-to-Digital Converter (ADC) with Chip-PCB Hierarchical Structure

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Si-interposer Design for GPU-Memory Integration concerning the Signal Integrity