,

Coaxial through-package-vias (TPVs) for enhancing power integrity in 3D double-side glass interposers

,

Electrical Design of silicon, glass and organic interposer channels

,

Worst Case Eye Estimation Method considering Power Noise on Tx Output Driver and Channel Crosstalk & ISI in Interposer-based 2.5D Interfaces

,

Magnetic Field Coupling on Analog-to-digital Converter from Wireless Power Transfer System in Automotive Environment

,

Modeling and Analysis of Open Defect in Through Silicon Via (TSV) Channel