,

Noise Coupling Analysis between TSV and Active Circuit

,

Contactless Wafer-Level TSV Connectivity Testing Method Using Magnetic Coupling

,

Disconnection failure model and analysis of TSV-based 3D ICs

,

Optimized Inverter Design of Ring Oscillator based Wafer-Level TSV Connectivity Test (RO-TSV-CT)

,

Design and Implementation of Magnetically Coupled Current Probe for Monitoring Simultaneous Switching current in Package