발행물
컨퍼런스
2012 IEEE Electrical Design of Advanced Package & Systems Symposium
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Design and Characterization of Magnetically Coupled On-Chip Current Probe for Monitoring Switching Current in Chip I/O PDN
IEEE 38th International symposium of Test and Failure Analysis (ISTFA)
High-frequency TSV Failure Detection Method with Z parameter
21th Conference on Electrical Performance of Electronic Packaging and Systems
A Compact On-interposer Passive Equalizer for Chip-to-chip High-speed Data Transmission
Embedded Toroidal Magnetic Coupling Probe in Multi-layer PCBs for Current Measurement
Conference on Electrical Performance of Electronic Packaging and Systems
Graphene-based EMI Shielding for Vertical Noise Coupling Reduction in 3D Mixed-Signal System_revised