발행물
컨퍼런스
20th Conference on Electrical Performance of Electronic Packaging and Systems
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Through-Silicon Via (TSV) Depletion Effect
High-Freuquency TSV Failure Analysis
Distributed Multi TSV 3D Clock Distribution Network in TSV-based 3D IC
Decoupling capacitor stacked chip (DCSC) in TSV-based 3D-ICs
IEEE ISAP
Optimal Electromagnetic Field Design of Wireless Power Transfer System in On-Line Electric Vehicle