,

PDN Analysis of TSV based Decoupling Capacitor Stacked Chip (DCSC) in 3D-ICs

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Analytical Model for Predicting the Electromagnetic Fields Intensity in Wireless Power Transfer Systems

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Analytical Expressions for Maximum Transferred Power in Wireless Power Transfer Systems

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Noise Isolation Modeling of Partial EBG Power Bus using Segmentation Method and Cavity Model in Multi-layer PCBs

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Measurement and analysis of vertical noise coupling on low noise amplifier from on-chip switching-mode DC-DC converter in 3D-IC