발행물
컨퍼런스
2011 Asia-Pacific Symposium on Electromagnetic Compatibility
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Vertically Alternating Impedance Electromagnetic Bandgap (VAI-EBG) Structure for Noise Mitigation in Multi-layer PCBs
통신정보합동학술대회(JCCI)
온라인 전기자동차의 전력 전달 및 자기장 최적화 설계
12th International Symposium on Quality Electronic Design, ISQED 2011
Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs
CIRP Design Conference 2011
Magnetic Field Design for Low EMF and High Efficiency Wireless Power Transfer System in On-Line Electric Vehicle
2011 Design, Automation & Test in Europe (DATE) Conference
Electrical Performance of 3D TSV Channel and 3D Stacked PDN based on Hierarchical Models