발행물
컨퍼런스
Conference on Electrical Performance of Electronic Packaging and Systems
,
Frequency and Time Domain Measurement of Through-Silicon Via (TSV) Failure
2012 IEEE Electromagnetic Compatibility Symposium
Protection of a Delay-Locked Loop from Simultaneous Switching Noise Coupling using an On-Chip Electromagnetic Bandgap Structure
On-chip Magnetic Resonant Coupling with Multi-Stacked Inductive Coils for Chip-to-chip Wireless Power Transfer (WPT)
On-chip Design Technque for Reducing Power Supply Noise Coupling on ADC with Chip-PCB Hierarchical Structure
Suppression of Leakage Magnetic Field from a Wireless Power Transfer System using Ferrimagnetic Material and Metallic Shielding