발행물
컨퍼런스
62nd Electronic Components and Technology Conference (ECTC)
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TSV-based Decoupling Capacitor Schemes in 3D-IC
2012 Asia-Pacific Symposium on Electromagnetic Compatibility, AP-EMC 2012
Analysis of EMF Noise from the Receiving Coil Topologies for Wireless Power Transfer
Near-Field Intensity Prediction Model at Maximum Transferred Power Frequency in Mutual-coupled Rectangular Coils for WPT System
2012 Korea-Japan EMT/EMC/BE Joint Conference
Design Considerations of Electromagnetic Field from Wireless Power Transfer System for Portable Electronic Devices
2012 Korea-Japan EMT/EMC/BE Joint Conference (KJJC-2012)
Basic Analysis of Signal and Power Integrity of TSV Applications