발행물
컨퍼런스
21th Conference on Electrical Performance of Electronic Packaging and Systems
,
Graphen-Based EMI Shielding for Vertical Noise Coupling Reduction in 3D Mixed-Signal System
8th International Workshop on Electromagnetic Compatibility of Integrated Circuits
Modeling of Simultaneous Switching Noise Effects on Jitter Characteristics of Delay Locked Loop in a Hierarchical System of Chip-Package-PCB
Vertical Noise Coupling on Wideband Low Noise Amplifier from On-chip Switching-Mode DC-DC Converter in 3D-IC
Modeling and Analysis of Power Supply Noise Effects on Analog-to-Digital Converter in 3DIC
20th Conference on Electrical Performance of Electronic Packaging and Systems
Temperature-Dependent Through-Silicon Via (TSV) Model and Noise Coupling