,

Thermal Effects on Through-Silicon-Via (TSV) Signal Integrity

,

Vertical Tree 3-dimensional TSV Clock Distribution Network in 3D IC

,

Nonlinear Effects of TSV and Harmonic Generation

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Effects of On-Chip Decoupling Capacitors and Silicon Substrate on Power Distribution Networks in TSV-based 3D-Ics

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High-frequency Measurements of TSV failures