발행물
컨퍼런스
중국전자공학회
1995
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Plasma deposited amorphous tungsten nitride diffusion barrier for metal-organic chemical vapor deposited Cu metallizations
미국물리학회
Comparison of amorphous nitride diffusion barrier for MOCVD-Cu metallization
Characteristics of excimer-laser-crystalliged polysilicon films by line beam scanning method
네들란드물리학회
1994
Performance of plasma deposited tungsten and tungsten nitride as thermally stable schottky contacts to GaAs.
Effects of Pt/W67N33 bottom electrode on dielectric properties of BaTiO₃ thin films.