시스템 온 칩용 인덕터의 제조 방법(Method for Manufacturing an Inductor for a System on Chip)

반도체소자의 선택적 구리 합금 배선 및 그 형성방법(Selective Copper Alloy Interconnections in Semiconductor Devices and Methods of the Same

구리 부식 억제 세정 용액 및 이를 이용하는 씨엠피 공정(Solution of Inhibiting Copper Erosion and CMP Process Using the Solution)

Selective Copper Alloy Interconnections in Semiconductor Devices and Methods of Forming the Same

반도체 소자의 다마신 배선 형성 방법 및 이에 의해 제조된 반도체 소자(Method of Fabricating Damascene Interconnection Line in Semiconductor Devices and Semiconductor Devices Fabricated by the Same)

Electroplating Apparatus and Electroplating Method Using the Same

Methods of Forming Metal Layers in Integrated Circuit Devices Using Selective Deposition on Edges of Recesses

Method of Chemical Mechanical Polishing

반도체 장치의 구리 배선 형성 방법(Method for Forming Cu Interconnection Line in Semiconductor Device)

선택적 전기도금 공정을 이용한 금속패턴 형성방법(Method of Forming Metal Pattern Using Selective Electroplating Process)