Metal sputter system
Target (Ti, TiN, W, Al) Wafer size (<4 inch) Loadlock / Heater (max 500ºC) Year: 2023
Thermal atomic layer deposition
Precursor (Hf, Zr, Al) / Reactant (O3, H2O) Wafer size (<6 inch) Traveling wave type Year: 2024
E-beam evaporator system
Source (Al, W, Au, Cr, Ag, Ti, Ni, Pd) Wafer size (<4 inch) Loadlock Year: 2024
Rapid thermal process
Temperature range (max 1250ºC) Ramp rate (10-200ºC/s) Wafer size (<4 inch) Year: 2024
Rapid thermal annealing
Temperature range (max 1000ºC) Ramp rate (50ºC/s) Wafer size (<4 inch) Year: 2023
Tube furnace
Temperature range (max 1200ºC) Quartz tube (length 1000 mm) MFC, BPR, chiller Year: 2022
Hot plate
Temperature range (max 500ºC) Time range (0-100 hours) Size (400 x 300 mm) Year: 2023
Fume Hood
Size (W1200 x D800 x H2350 mm) Year: 2023
Reagent cabinet
Size (W800 x D540 x H1950 mm) Year: 2023
Electronic scale
Weight (max 6100 g) Measurement range (0.01 g) Year: 2024