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Power distribution network design and optimization based on frequency dependent target impedance

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Analysis of through glass via (TGV) noise coupling effect to noise figure of 2.4GHz LNA on glass interposer

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Safety and reliability verification process of coil module in wireless power transfer system using circuit level sensitivity simulation

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Electrical characteristics analysis and comparison between through silicon via(TSV) and through glass via(TGV)

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Modeling and analysis of a conductive rubber contactor for package test