발행물
컨퍼런스
24rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
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Design of On-Chip Linear Voltage Regulator ModuleAnd Measurement of Power Distribution NetworkNoise Fluctuation at High-Speed Output Buffer
IEEE International 3D Systems Integration Conference (3DIC)
Noise Coupling Modeling and Analysis of Through Glass Via(TGV)
Electrical Performance of High Bandwidth Memory (HBM) Interposer Channel in Terabyte/s Bandwidth Graphics Module
Crosstalk-Included Eye-Diagram Estimation for High-speed Silicon, Organic, and Glass Interposer Channels on 2.5D/3D IC
Modeling and Analysis of Defects in Through Silicon Via Channel for Non-invasive Fault Isolation