,

Noise coupling emulation between TSV and active circuit through metal oxide patch

,

Precise RLGC Modeling and Analysis of Through Glass Via (TGV) for 2.5D/3D IC

,

Signal Integrity Design of Bump-less Interconnection for High-speed Signaling in 2.5D and 3D IC

,

Modeling and Analysis of Return Paths of Common Mode EMI Noise Currents From Motor Drive System in Hybrid Electric Vehicle

,

A Fast and Accurate Statistical Eye-diagram Estimation Method for High-speed Channel Including Non-linear Receiver Buffer Circuit