발행물
컨퍼런스
Joint IEEE International Symposium on Electromagnetic Compatibility and EMC Europe, Dresden 2015
,
Inverter Modeling Including Non-ideal IGBT Characteristics in Hybrid Electric Vehicle for Accurate EMI Noise Prediction
Design of Conductive Shield for Wireless Power Transfer System for Electric Vehicle Considering Automotive Body
IEEE International Symposium on Electromagnetic Compatibility, EMC 2015
Through silicon via time domain crosstalk modeling considering hysteretic coupling capacitance
International 3D Systems Integration Conference, 3DIC 2015
Active Si interposer for 3D IC integrations
65th Electronic Components and Technology Conference (ECTC)
Signal and power integrity analysis in 2.5D integrated circuits (ICs) with glass, silicon and organic interposer